SOLDER PASTE, SN, BI, AG, 138DEG C, 60G
Product Code: SMDLTLFP60T4
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Supplier product description
SOLDER PASTE, SN, BI, AG, 138DEG C, 60G; Flux Type:No Clean; Solder Alloy:42, 57.6, 0.4 Sn, Bi, Ag; Melting Temperature:138┬░C; Weight - Metric:60g; Weight - Imperial:2.116oz; Product Range:-; SVHC:No SVHC (15-Jan-2019);
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Supplier parameters
Product code
SMDLTLFP60T4
Brand
CHIP QUIK
Supplier's product code
2529023
Product ID
U-1131997
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