Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm AG TERMOPASTY
Product Code: ZAL-SIL-021
Brand
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Product description
Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm AG TERMOPASTY
Specifications
Supplier product description
Silicone encapsulating compound; white; Temp: -50÷200°C; 20kV/mm
Supplier parameters
Product code
ZAL-SIL-021
Agent features
condensation cure
Appearance
paste
Application
sealing and encapsulation of electronic circuits
Available labels languages
PL
Bonding time
30min
Colour
white
Curing method
RTV
Density
1.2g/cm<sup>3</sup> @ 25°C
Dielectric constant
3
Dielectric strength
20kV/mm
Manufacturer
AG TERMOPASTY
Mix ratio
100:10
Net weight
110g
Operating temperature
-50...200°C
Shore hardness
59
Surface resistance
<2410TΩ
Thermal conductivity
1.2W/mK
Type of chemical agent
silicone encapsulating compound
Brand
AG TERMOPASTY
Supplier's product code
ZAL-SIL-021
Product ID
U-388722
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