FILLER PAD, SILICONE FREE, 2W/MK, 1.0MM
Product Code: MSFP200-1.0
Brand
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Specifications
Supplier product description
FILLER PAD, SILICONE FREE, 2W/MK, 1.0MM; Insulator Body Material:-; Thermal Conductivity:2W/m.K; Breakdown Voltage Vbr:7kV; Thickness:1mm; Volume Resistivity:100000000000ohm-cm; Thermal Impedance:-; Dielectric Strength:1
Useful information
Supplier parameters
Product code
MSFP200-1.0
Brand
AMEC THERMASOL
Supplier's product code
2289529
Product ID
U-1015255
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