Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
Product Code: 374224B00035G
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Product description
Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
Useful information
Specifications
SKU
U-2467188
Product code
374224B00035G
Supplier product description
Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
Useful information
Supplier parameters
Product code
374224B00035G
Product ID
U-2467188
Application
BGA
Height
25mm
Length
23mm
Manufacturer
BOYD CORP
Material
aluminium
Type of heatsink
extruded
Width
23mm
Supplier's product code
374224B00035G
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