Soldering paste TSC305 (Sn96,5Ag3,0Cu0,5), Stannol
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Experimental product description generated by artificial intelligence
Soldering Paste TSC305 (Sn96,5Ag3,0Cu0,5)
STANNOL brand soldering paste, also known as solder flux, is designed for use with lead-free TSC305 alloy (Sn96.5Ag3.0Cu0.5). This high-quality product contains a highly active type L No-Clean flux, ensuring excellent wetting properties for efficient soldering.
Key Features and Benefits
- Lead-free formulation: Environmentally friendly and compliant with RoHS standards.
- No-Clean flux: Minimizes residue after reflowing, reducing the need for post-soldering cleaning.
- Excellent wetting: Ensures strong and reliable solder joints, even on challenging surfaces.
- Suitable for high-volume production: Optimized for use in automated soldering processes.
- High tackiness: Ideal for use with high-speed placement machines.
- Electrically safe residue: The small amount of residue left after reflowing is electrically safe and does not require removal.
Applications
STANNOL TSC305 soldering paste is suitable for various soldering applications, including:
- Soldering of electronic components
- Brazing
Why Choose STANNOL TSC305?
STANNOL TSC305 soldering paste offers superior performance and reliability compared to other soldering pastes. Its unique formulation ensures excellent wetting, minimal residue, and ease of use, making it the ideal choice for professionals and hobbyists alike.
| Property | Value |
|---|---|
| Alloy | Sn96.5Ag3.0Cu0.5 |
| Flux Type | No-Clean |
This description is generated using artificial intelligence (AI) and may differ from the actual product. Common AI errors may include:
- Inaccurate product features: some technical specifications, colors, sizes or other parameters may be inaccurate or omitted.
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If you notice inconsistencies or have questions about the description, please contact us before purchasing the product, please contact us by e-mail to you: [email protected].