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Product description
SOLDER PASTE, SN, AG, CU, 217DEG C, 60G
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Specifications
Supplier product description
SOLDER PASTE, SN, AG, CU, 217DEG C, 60G; Flux Type:No Clean; Solder Alloy:96.5, 3, 0.5 Sn, Ag, Cu; Melting Temperature:217┬░C; Weight - Metric:60g; Weight - Imperial:2.116oz; Product Range:-; SVHC:No SVHC (15-Jan-2019); W
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Supplier parameters
Product code
SMD291SNL60T4
Brand
CHIP QUIK
Supplier's product code
2529025
Product ID
U-1131999
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