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Specifications
Supplier product description
The aluminum heatsink designed specifically for the Compute Module 5 is a reliable cooling solution that ensures optimal thermal performance for key module components. Thermal pads are included to maximize the efficiency of heat transfer from the processor, memory, wireless module (if present), and eMMC (if present) to the heatsink.
Supplier parameters
Product code
RPI-25747
Brand
RASPBERRY-PI
Supplier's product code
RPI-25747
Product ID
U-4320405
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